๐”– Bobbio Scriptorium
โœฆ   LIBER   โœฆ

Impression creep of Sn3.5Ag eutectic alloy

โœ Scribed by Fuqian Yang; Lingling Peng


Publisher
Elsevier Science
Year
2005
Tongue
English
Weight
530 KB
Volume
409
Category
Article
ISSN
0921-5093

No coin nor oath required. For personal study only.


๐Ÿ“œ SIMILAR VOLUMES


Impression creep characterization of rap
โœ I Dutta; C Park; S Choi ๐Ÿ“‚ Article ๐Ÿ“… 2004 ๐Ÿ› Elsevier Science ๐ŸŒ English โš– 400 KB

The creep behavior of solders crucially influences solder joint reliability in microelectronic packages. This, in conjunction with the ongoing industry-wide transition to lead-free solders, has resulted in significant current emphasis on developing approaches for expeditiously creep testing miniatur