Impression creep characterization of rap
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I Dutta; C Park; S Choi
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Article
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2004
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Elsevier Science
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English
โ 400 KB
The creep behavior of solders crucially influences solder joint reliability in microelectronic packages. This, in conjunction with the ongoing industry-wide transition to lead-free solders, has resulted in significant current emphasis on developing approaches for expeditiously creep testing miniatur