✦ LIBER ✦
A mechanics-induced complication of impression creep and its solution: application to Sn–3.5Ag solder
✍ Scribed by Deng Pan; I. Dutta
- Publisher
- Elsevier Science
- Year
- 2004
- Tongue
- English
- Weight
- 654 KB
- Volume
- 379
- Category
- Article
- ISSN
- 0921-5093
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