Impact on Electromigration Performance of Combining CuSiN and Ti-Barrier Metal in Cu Interconnects

✍ Scribed by Hayashi, Y.; Matsunaga, N.; Wada, M.; Nakao, S.; Watanabe, K.; Sakata, A.; Shibata, H.

• Book ID: 111922068
• Publisher: IEEE
• Year: 2012
• Tongue: English
• Weight: 760 KB
• Volume: 59
• Category: Article
• ISSN: 0018-9383
• DOI: 10.1109/ted.2011.2179805