Impact of thermal cycling on the evolution of grain, precipitate and dislocation structure in Al, 0.5% Cu, 1% Si thin films

✍ Scribed by B. Kaouache; P. Gergaud; O. Thomas; O. Bostrom; M. Legros

• Publisher: Elsevier Science
• Year: 2003
• Tongue: English
• Weight: 791 KB
• Volume: 70
• Category: Article
• ISSN: 0167-9317
• DOI: 10.1016/s0167-9317(03)00385-x