This book covers theoretical and practical aspects of all major steps in the fabrication sequence. This book can be used conveniently in a semester length course on integrated circuit fabrication. This text can also serve as a reference for practicing engineer and scientist in the semiconductor indu
III-V integrated circuit fabrication technology
โ Scribed by Biswas, Dhrubes; Tiku, Shiban Kishan
- Publisher
- Pan Stanford Publishing
- Year
- 2016
- Tongue
- English
- Leaves
- 706
- Category
- Library
No coin nor oath required. For personal study only.
โฆ Table of Contents
Content: 1. Semiconductor basics --
2. GaAs devices --
3. Phase diagrams and crystal growth of compound semiconductors --
4. Epitaxy --
5. Photolithography --
6. Wet etching, cleaning, and passivation --
7. Plasma processing and dry etching --
8. Deposition processes --
9. Ion implantation and device isolation --
10. Diffusion in III-V compound semiconductors --
11. Ohmic contacts --
12. Schottky diodes and FET processing --
13. HEMT process --
14. HBT processing --
15. BiFET and BiHEMT processing --
16. MOSFET processing --
17. Passive components --
18. Interconnect technology --
19. Backend processing and through-wafer vias --
20. Electroplating --
21. Measurements and characterization --
22. Reliability --
23. GaN devices --
24. RF MEMS.
โฆ Subjects
Compound semiconductors.;Integrated circuits.
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