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[IEEE TRANSDUCERS 2011 - 2011 16th International Solid-State Sensors, Actuators and Microsystems Conference - Beijing, China (2011.06.5-2011.06.9)] 2011 16th International Solid-State Sensors, Actuators and Microsystems Conference - Impact of encapsulation materials on the performance of silicon-based solid state high pressure sensors with surface trenches

✍ Scribed by Baumann, M.; Sander, C.; Ruther, P.; Paul, O.

Book ID: 118237753
Publisher: IEEE
Year: 2011
Weight: 904 KB
Volume: 0
Category: Article
ISBN: 145770157X
DOI: 10.1109/transducers.2011.5969172

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