𝔖 Bobbio Scriptorium

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[IEEE Proceedings. Seventh IEEE/CHMT International Electronic Manufacturing Technology Symposium - San Francisco, CA, USA (25-27 Sept. 1989)] Proceedings. Seventh IEEE/CHMT International Electronic Manufacturing Technology Symposium - Nondestructive evaluation of debonding within plastic integrated circuit packages using different methods of acoustic microscopy

✍ Scribed by Semmens, J.E.; Kessler, L.W.

Book ID: 126767337
Publisher: IEEE
Year: 1989
Weight: 125 KB
Category: Article
DOI: 10.1109/EMTS.1989.68997

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