𝔖 Bobbio Scriptorium

✦ LIBER ✦

[IEEE Proceedings of the Sixth IEEE CPMT Conference on High Density Microsystem Design and Packaging and Component Failure Analysis (HDP '04) - Shanghai, China (30 June-3 July 2004)] Proceedings of the Sixth IEEE CPMT Conference on High Density Microsystem Design and Packaging and Component Failure Analysis (HDP '04) - A lead-free, low-temperature sintering die-attach technique for high-performance and high-temperature packaging

✍ Scribed by Guo-Quan Lu, ; Calata, J.N.; Zhiye Zhang, ; Bai, J.G.

Book ID: 120224968
Publisher: IEEE
Year: 2004
Tongue: English
Weight: 717 KB
Category: Article
ISBN-13: 9780780386204
DOI: 10.1109/HPD.2004.1346671

No coin nor oath required. For personal study only.

📜 SIMILAR VOLUMES

[IEEE Proceedings of the Sixth IEEE CPMT

[IEEE Proceedings of the Sixth IEEE CPMT Conference on High Density Microsystem Design and Packaging and Component Failure Analysis (HDP '04) - Shanghai, China (30 June-3 July 2004)] Proceedings of the Sixth IEEE CPMT Conference on High Density Microsystem Design and Packaging and Component Failure Analysis (HDP '04) - Design of a high performance microcontroller

✍ Hu Yue-li, ; Cao Jia-lin, ; Ran Feng, ; Liang Zhi-jian, 📂 Article 📅 2004 🏛 IEEE 🌐 English ⚖ 407 KB

[IEEE Proceedings of the Sixth IEEE CPMT

[IEEE Proceedings of the Sixth IEEE CPMT Conference on High Density Microsystem Design and Packaging and Component Failure Analysis (HDP '04) - Shanghai, China (30 June-3 July 2004)] Proceedings of the Sixth IEEE CPMT Conference on High Density Microsystem Design and Packaging and Component Failure Analysis (HDP '04) - Packaging influence on acceleration sensitivity of pyroelectric infrared detectors

✍ Gerlach, G.; Shvedov, D.; Norkus, V. 📂 Article 📅 2004 🏛 IEEE 🌐 English ⚖ 578 KB

[IEEE Proceedings of the Sixth IEEE CPMT

[IEEE Proceedings of the Sixth IEEE CPMT Conference on High Density Microsystem Design and Packaging and Component Failure Analysis (HDP '04) - Shanghai, China (30 June-3 July 2004)] Proceedings of the Sixth IEEE CPMT Conference on High Density Microsystem Design and Packaging and Component Failure Analysis (HDP '04) - On-chip high-Q solenoid inductors embedded in WL-CSP

✍ Itoi, K.; Sato, M.; Abe, H.; Ito, H.; Sugawara, H.; Okada, K.; Masu, K.; Ito, T. 📂 Article 📅 2004 🏛 IEEE 🌐 English ⚖ 466 KB

[IEEE Proceedings of the Sixth IEEE CPMT

[IEEE Proceedings of the Sixth IEEE CPMT Conference on High Density Microsystem Design and Packaging and Component Failure Analysis (HDP '04) - Shanghai, China (30 June-3 July 2004)] Proceedings of the Sixth IEEE CPMT Conference on High Density Microsystem Design and Packaging and Component Failure Analysis (HDP '04) - A study of threshold variation compensated inverter-comparator for pulse circuits

✍ Cong Feng, ; Zhang Jinyi, ; Yan Limin, 📂 Article 📅 2004 🏛 IEEE 🌐 English ⚖ 313 KB

[IEEE Proceedings of the Sixth IEEE CPMT

[IEEE Proceedings of the Sixth IEEE CPMT Conference on High Density Microsystem Design and Packaging and Component Failure Analysis (HDP '04) - Shanghai, China (30 June-3 July 2004)] Proceedings of the Sixth IEEE CPMT Conference on High Density Microsystem Design and Packaging and Component Failure Analysis (HDP '04) - The effect of current crowding on electromigration in lead-free flip chip bump interconnect

✍ Wang Lei, ; Wu Fengshun, ; Wu Yiping, ; Zhang Jinsong, 📂 Article 📅 2004 🏛 IEEE ⚖ 458 KB

[IEEE Conference on High Density Microsy

[IEEE Conference on High Density Microsystem Design and Packaging and Component Failure Analysis, 2006. HDP'06. - Shanghai, China (2006.06.27-2006.06.28)] Conference on High Density Microsystem Design and Packaging and Component Failure Analysis, 2006. HDP'06. - Nonlinear behaviors of transducer dynamics for thermosonic bonding

✍ Lei Han, ; Jue Zhong, 📂 Article 📅 2006 🏛 IEEE ⚖ 599 KB