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[IEEE Proceedings of the 2006 IEEE International Symposium on Electronics and the Environment, 2006. - Scottsdale, AZ, USA (2006.05.8-2006.05.11)] Proceedings of the 2006 IEEE International Symposium on Electronics and the Environment, 2006. - Novel Nanotechnology for Environmentally Friendly Interconnect Materials in Microelectronic Packaging Applications

✍ Scribed by Yi Li, ; Kyoung-sik Moon, ; Wong, C.P.

Book ID: 125523140
Publisher: IEEE
Year: 2006
Weight: 705 KB
Category: Article
ISBN-13: 9781424403516
DOI: 10.1109/ISEE.2006.1650027

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