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[IEEE Proceedings of the 2006 IEEE International Symposium on Electronics and the Environment, 2006. - Scottsdale, AZ, USA (2006.05.8-2006.05.11)] Proceedings of the 2006 IEEE International Symposium on Electronics and the Environment, 2006. - An Environmental Analysis of Injection Molding

✍ Scribed by Thiriez, A.; Gutowski, T.

Book ID: 120911119
Publisher: IEEE
Year: 2006
Weight: 239 KB
Category: Article
ISBN-13: 9781424403516
DOI: 10.1109/ISEE.2006.1650060

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