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[IEEE Proceedings. Japan IEMT Symposium, Sixth IEEE/CHMT International Electronic Manufacturing Technology Symposium - Nara, Japan (26-28 April 1989)] Proceedings. Japan IEMT Symposium, Sixth IEEE/CHMT International Electronic Manufacturing Technology Symposium - Silver glass die attach adhesives for power semiconductor devices

✍ Scribed by Dequidt, M.; Guinet, J.; Hubert, J.C.

Book ID: 126648830
Publisher: IEEE
Year: 1989
Weight: 361 KB
Category: Article
DOI: 10.1109/IEMTS.1989.76170

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