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[IEEE Proceedings. Japan IEMT Symposium, Sixth IEEE/CHMT International Electronic Manufacturing Technology Symposium - Nara, Japan (26-28 April 1989)] Proceedings. Japan IEMT Symposium, Sixth IEEE/CHMT International Electronic Manufacturing Technology Symposium - Moisture resistance of epoxy resin used for extremely low profile IC modules

✍ Scribed by Hirayama, H.; Totsuka, N.; Nambu, S.

Book ID: 126623381
Publisher: IEEE
Year: 1989
Weight: 262 KB
Category: Article
DOI: 10.1109/IEMTS.1989.76167

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