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[IEEE Proceedings. Japan IEMT Symposium, Sixth IEEE/CHMT International Electronic Manufacturing Technology Symposium - Nara, Japan (26-28 April 1989)] Proceedings. Japan IEMT Symposium, Sixth IEEE/CHMT International Electronic Manufacturing Technology Symposium - Holographic pattern testing of printed circuit board (PCB) deformation due to thermal stress

✍ Scribed by Taniguchi, M.; Takagi, T.

Book ID: 126639052
Publisher: IEEE
Year: 1989
Weight: 468 KB
Category: Article
DOI: 10.1109/IEMTS.1989.76155

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