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[IEEE Proceedings. Japan IEMT Symposium, Sixth IEEE/CHMT International Electronic Manufacturing Technology Symposium - Nara, Japan (26-28 April 1989)] Proceedings. Japan IEMT Symposium, Sixth IEEE/CHMT International Electronic Manufacturing Technology Symposium - A new face down bonding technique using a low melting point metal

✍ Scribed by Mori, M.; Saito, M.; Hongu, A.; Niitsuma, A.; Ohdaira, H.

Book ID: 126614384
Publisher: IEEE
Year: 1989
Weight: 444 KB
Category: Article
DOI: 10.1109/IEMTS.1989.76119

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