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[IEEE International Electron Devices Meeting 1991 [Technical Digest] - Washington, DC, USA (8-11 Dec. 1991)] International Electron Devices Meeting 1991 [Technical Digest] - A new three dimensional IC fabrication technology, stacking thin film DUAL-CMOS layers

✍ Scribed by Hayashi, Y.; Oyama, K.; Takahashi, S.; Wada, S.; Kajiyana, K.; Koh, R.; Kunio, T.

Book ID: 126665181
Publisher: IEEE
Year: 1991
Weight: 337 KB
Category: Article
ISBN-13: 9780780302433
DOI: 10.1109/IEDM.1991.235336

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