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[IEEE International Conference on Indium Phosphide and Related Materials - Santa Barbara, CA, USA (12-16 May 2003)] International Conference onIndium Phosphide and Related Materials, 2003. - High-frequency IC packaging technologies

✍ Scribed by Hirose, T.

Book ID: 126657601
Publisher: IEEE
Year: 2003
Weight: 264 KB
Category: Article
ISBN-13: 9780780377042
DOI: 10.1109/ICIPRM.2003.1205355

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