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[IEEE IEEE International Solid-State Sensors and Actuators Conference - Boston, MA, USA (8-12 June 2003)] TRANSDUCERS '03. 12th International Conference on Solid-State Sensors, Actuators and Microsystems. Digest of Technical Papers (Cat. No.03TH8664) - Metal to glass anodic bonding for microsystems packaging

✍ Scribed by Briand, D.; Weber, P.; de Rooij, N.F.

Book ID: 120932640
Publisher: IEEE
Year: 2003
Tongue: English
Weight: 336 KB
Volume: 2
Category: Article
ISBN-13: 9780780377318
DOI: 10.1109/SENSOR.2003.1217142

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