✦ LIBER ✦

[IEEE IEEE International Electron Devices Meeting 2003 - Washington, DC, USA (8-10 Dec. 2003)] IEEE International Electron Devices Meeting 2003 - Thermal analysis of ultra-thin body device scaling [SOI and FinFet devices]

✍ Scribed by Pop, E.; Dutton, R.; Goodson, K.

No coin nor oath required. For personal study only.

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