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[IEEE IEEE Compound Semiconductor Integrated Circuit Symposium. 2004 IEEE CISC Symposium - Monterey, CA, USA (24-27 Oct. 2004)] 2004 IEEE International SOI Conference (IEEE Cat. No.04CH37573) - Recent progress in packaging of RF MEMS

✍ Scribed by Seki, T.

Book ID: 126826008
Publisher: IEEE
Year: 2004
Tongue: English
Weight: 267 KB
Category: Article
ISBN-13: 9780780386167
DOI: 10.1109/csics.2004.1392547

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