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[IEEE IEEE 9th Topical Meeting on Electrical Performance of Electronic Packaging - Scottsdale, AZ, USA (23-25 Oct. 2000)] IEEE 9th Topical Meeting on Electrical Performance of Electronic Packaging (Cat. No.00TH8524) - High-speed and high-density chip-to-chip interconnections: trends and techniques

✍ Scribed by Schmatz, M.L.

Book ID: 120928513
Publisher: IEEE
Year: 2000
Tongue: English
Weight: 168 KB
Edition: 2000, 9th ed.
Category: Article
ISBN-13: 9780780364509
DOI: 10.1109/EPEP.2000.895484

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