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[IEEE IEEE 8th Topical Meeting on Electrical Performance of Electronic Packaging - San Diego, CA, USA (25-27 Oct. 1999)] IEEE 8th Topical Meeting on Electrical Performance of Electronic Packaging (Cat. No.99TH8412) - Validation of integrated capacitor-via-planes model

✍ Scribed by Yuan-Liang Li, ; Figueroa, D.G.; Teong Guan Yew, ; Chee Yee Chung,

Book ID: 126730495
Publisher: IEEE
Year: 1999
Weight: 283 KB
Category: Article
ISBN-13: 9780780355972
DOI: 10.1109/EPEP.1999.819207

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