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[IEEE IEEE 8th Topical Meeting on Electrical Performance of Electronic Packaging - San Diego, CA, USA (25-27 Oct. 1999)] IEEE 8th Topical Meeting on Electrical Performance of Electronic Packaging (Cat. No.99TH8412) - Improved global rational approximation macromodeling algorithm for transient simulation of interconnects

✍ Scribed by Elzinga, M.; Virga, K.; Prince, J.L.

Book ID: 126655862
Publisher: IEEE
Year: 1999
Weight: 248 KB
Category: Article
ISBN-13: 9780780355972
DOI: 10.1109/EPEP.1999.819199

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