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[IEEE IEEE 14th Topical Meeting on Electrical Performance of Electronic Packaging, 2005. - Austin, TX, USA (Oct. 24-26, 2005)] IEEE 14th Topical Meeting on Electrical Performance of Electronic Packaging, 2005. - Waveform relaxation techniques for simulation of coupled interconnects with frequency-dependent parameters

✍ Scribed by Nakhla, N.; Ruehlit, A.; Nakhla, M.; Achar, R.; Changzhong Chen,

Book ID: 127186454
Publisher: IEEE
Year: 2005
Weight: 669 KB
Category: Article
ISBN-13: 9780780392205
DOI: 10.1109/epep.2005.1563697

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