𝔖 Bobbio Scriptorium

✦ LIBER ✦

[IEEE ICEPT 2003. Fifth International Conference on Electronic Packaging Technology. Proceedings - Shanghai, China (2003.10.28-2003.10.30)] Fifth International Conference onElectronic Packaging Technology Proceedings, 2003. ICEPT2003. - New anisotropic conductive film (ACF)

✍ Scribed by Yokoyama, A.; Maehara, K.; Takagi, K.

Book ID: 126614304
Publisher: IEEE
Year: 2003
Weight: 207 KB
Category: Article
ISBN-13: 9780780381681
DOI: 10.1109/EPTC.2003.1298744

No coin nor oath required. For personal study only.

📜 SIMILAR VOLUMES

[IEEE ICEPT 2003. Fifth International Co

[IEEE ICEPT 2003. Fifth International Conference on Electronic Packaging Technology. Proceedings - Shanghai, China (2003.10.28-2003.10.30)] Fifth International Conference onElectronic Packaging Technology Proceedings, 2003. ICEPT2003. - Unique white LED packaging systems

✍ Okuno, A.; Miyawaki, Y.; Oyama, N.; Dongxu, W. 📂 Article 📅 2003 🏛 IEEE 🌐 English ⚖ 347 KB

[IEEE ICEPT 2003. Fifth International Co

[IEEE ICEPT 2003. Fifth International Conference on Electronic Packaging Technology. Proceedings - Shanghai, China (2003.10.28-2003.10.30)] Fifth International Conference onElectronic Packaging Technology Proceedings, 2003. ICEPT2003. - Computer aided reliability assessment

✍ Ji Wu, ; Pecht, M.; Jiaji Wang, 📂 Article 📅 2003 🏛 IEEE ⚖ 276 KB

[IEEE ICEPT 2003. Fifth International Co

[IEEE ICEPT 2003. Fifth International Conference on Electronic Packaging Technology. Proceedings - Shanghai, China (2003.10.28-2003.10.30)] Fifth International Conference onElectronic Packaging Technology Proceedings, 2003. ICEPT2003. - Emerging technologies; impetus for future high technology growth

✍ Bauer, C.E. 📂 Article 📅 2003 🏛 IEEE ⚖ 258 KB

[IEEE ICEPT 2003. Fifth International Co

[IEEE ICEPT 2003. Fifth International Conference on Electronic Packaging Technology. Proceedings - Shanghai, China (2003.10.28-2003.10.30)] Fifth International Conference onElectronic Packaging Technology Proceedings, 2003. ICEPT2003. - A preliminary research on the dehumidify technology of BGA

✍ Zhao Zhi-ping, 📂 Article 📅 2003 🏛 IEEE ⚖ 216 KB

[IEEE ICEPT 2003. Fifth International Co

[IEEE ICEPT 2003. Fifth International Conference on Electronic Packaging Technology. Proceedings - Shanghai, China (2003.10.28-2003.10.30)] Fifth International Conference onElectronic Packaging Technology Proceedings, 2003. ICEPT2003. - Study on a novel optical fiber pressure sensor

✍ Guanglong Wang, ; Yiton Fu, ; Welland, M.E.; Hodson, H.P.; Jusheng Ma, 📂 Article 📅 2003 🏛 IEEE ⚖ 345 KB

[IEEE ICEPT 2003. Fifth International Co

[IEEE ICEPT 2003. Fifth International Conference on Electronic Packaging Technology. Proceedings - Shanghai, China (2003.10.28-2003.10.30)] Fifth International Conference onElectronic Packaging Technology Proceedings, 2003. ICEPT2003. - New Au-Al interconnect technology and its reliability by surface activated bonding

✍ Zhonghua Xu, ; Suga, T.; Itoh, T.; Hosoda, N. 📂 Article 📅 2003 🏛 IEEE 🌐 English ⚖ 325 KB