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[IEEE ICEPT 2003. Fifth International Conference on Electronic Packaging Technology. Proceedings - Shanghai, China (2003.10.28-2003.10.30)] Fifth International Conference onElectronic Packaging Technology Proceedings, 2003. ICEPT2003. - Water absorption and corrosion protection of esterified novolac resin cured epoxy resins applicable for microelectronics packing

✍ Scribed by Shanjun Li, ; Xiaolin Tang, ; Yifu Ding, ; Mojun Liu,

Book ID: 124091342
Publisher: IEEE
Year: 2003
Tongue: English
Weight: 116 KB
Category: Article
ISBN-13: 9780780381681
DOI: 10.1109/EPTC.2003.1298756

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