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[IEEE High Density Packaging (ICEPT-HDP) - Beijing, China (2009.08.10-2009.08.13)] 2009 International Conference on Electronic Packaging Technology & High Density Packaging - Dynamic constitutive relation of EMC over a broad range of temperatures and strain rates

✍ Scribed by Chen, Tong; Niu, Xiaoyan; Shu, Xuefeng; Zhang, Jianwen

Book ID: 120560311
Publisher: IEEE
Year: 2009
Weight: 958 KB
Category: Article
ISBN: 1424446589
DOI: 10.1109/ICEPT.2009.5270651

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