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[IEEE ESSDERC 2003. 33rd European Solid-State Device Research - ESSDERC '03 - Estoril, Portugal (16-18 Sept. 2003)] Electrical Performance of Electrical Packaging (IEEE Cat. No. 03TH8710) - Optimisation of channel thickness in strained Si/SiGe MOSFETs

✍ Scribed by Kwa, K.S.K.; Chattopadhyay, S.; Olsen, S.H.; Driscoll, L.S.; O'Neill, A.G.

Book ID: 126642915
Publisher: IEEE
Year: 2003
Weight: 306 KB
Category: Article
ISBN-13: 9780780379992
DOI: 10.1109/ESSDERC.2003.1256923

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