𝔖 Bobbio Scriptorium

✦ LIBER ✦

[IEEE ESSDERC 2003. 33rd European Solid-State Device Research - ESSDERC '03 - Estoril, Portugal (16-18 Sept. 2003)] Electrical Performance of Electrical Packaging (IEEE Cat. No. 03TH8710) - Atomic-scale modeling of source-to-drain tunneling in ultimate Schottky barrier double-gate MOSFETs

✍ Scribed by Bescond, M.; Autran, J.L.; Munteanu, D.; Cavassilas, N.; Lannoo, M.

Book ID: 125535485
Publisher: IEEE
Year: 2003
Tongue: English
Weight: 283 KB
Category: Article
ISBN-13: 9780780379992
DOI: 10.1109/ESSDERC.2003.1256897

No coin nor oath required. For personal study only.

📜 SIMILAR VOLUMES

[IEEE ESSDERC 2003. 33rd European Solid-

[IEEE ESSDERC 2003. 33rd European Solid-State Device Research - ESSDERC '03 - Estoril, Portugal (16-18 Sept. 2003)] Electrical Performance of Electrical Packaging (IEEE Cat. No. 03TH8710) - Transistors in mesh array for power management applications

✍ Casimiro, A.P.; Santos, P.M.; Xu, J.N. 📂 Article 📅 2003 🏛 IEEE 🌐 English ⚖ 396 KB

[IEEE ESSDERC 2003. 33rd European Solid-

[IEEE ESSDERC 2003. 33rd European Solid-State Device Research - ESSDERC '03 - Estoril, Portugal (16-18 Sept. 2003)] Electrical Performance of Electrical Packaging (IEEE Cat. No. 03TH8710) - Scaling impact on analog performance of sub-100nm MOSFETs for mixed mode applications

✍ Garg, M.; Suryagandh, S.S.; Woo, J.C.S. 📂 Article 📅 2003 🏛 IEEE 🌐 English ⚖ 293 KB

[IEEE ESSDERC 2003. 33rd European Solid-

[IEEE ESSDERC 2003. 33rd European Solid-State Device Research - ESSDERC '03 - Estoril, Portugal (16-18 Sept. 2003)] Electrical Performance of Electrical Packaging (IEEE Cat. No. 03TH8710) - High-speed lateral polysilicon photodiode in standard CMOS technology

✍ Radovanovic, S.; Annoma, A.J.; Nauta, B. 📂 Article 📅 2003 🏛 IEEE 🌐 English ⚖ 311 KB

[IEEE ESSDERC 2003. 33rd European Solid-

[IEEE ESSDERC 2003. 33rd European Solid-State Device Research - ESSDERC '03 - Estoril, Portugal (16-18 Sept. 2003)] Electrical Performance of Electrical Packaging (IEEE Cat. No. 03TH8710) - Technology aspects of a CMOS neuro-sensor: back end process and packaging

✍ Hofmann, F.; Eversmann, B.; Jenkner, M.; Frey, A.; Merz, M.; Birkenmaier, T.; Fr 📂 Article 📅 2003 🏛 IEEE 🌐 English ⚖ 355 KB

[IEEE ESSDERC 2003. 33rd European Solid-

[IEEE ESSDERC 2003. 33rd European Solid-State Device Research - ESSDERC '03 - Estoril, Portugal (16-18 Sept. 2003)] Electrical Performance of Electrical Packaging (IEEE Cat. No. 03TH8710) - Elimination of accumulation charge effects for high-resistive silicon substrates

✍ Jansman, A.B.M.; van Beek, J.T.M.; van Delden, M.H.W.M.; Kemmeren, A.L.A.M.; den 📂 Article 📅 2003 🏛 IEEE 🌐 English ⚖ 269 KB

[IEEE ESSDERC 2003. 33rd European Solid-

[IEEE ESSDERC 2003. 33rd European Solid-State Device Research - ESSDERC '03 - Estoril, Portugal (16-18 Sept. 2003)] Electrical Performance of Electrical Packaging (IEEE Cat. No. 03TH8710) - Carrier quantization in SOI MOSFETs using an effective potential based Monte-Carlo tool

✍ Palestri, P.; Esseni, D.; Abramo, A.; Clerc, R.; Selmi, L. 📂 Article 📅 2003 🏛 IEEE 🌐 English ⚖ 332 KB