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[IEEE ESSDERC 2003. 33rd European Solid-State Device Research - ESSDERC '03 - Estoril, Portugal (16-18 Sept. 2003)] Electrical Performance of Electrical Packaging (IEEE Cat. No. 03TH8710) - Technology aspects of a CMOS neuro-sensor: back end process and packaging

✍ Scribed by Hofmann, F.; Eversmann, B.; Jenkner, M.; Frey, A.; Merz, M.; Birkenmaier, T.; Fromherz, P.; Schreiter, M.; Gabl, R.; Plehnert, K.; Steinhauser, M.; Eckstein, G.; Thewes, R.

Book ID: 118031126
Publisher: IEEE
Year: 2003
Tongue: English
Weight: 355 KB
Volume: 0
Category: Article
ISBN-13: 9780780379992
DOI: 10.1109/essderc.2003.1256837

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