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[IEEE Advances in Electronic Materials and Packaging 2001 - Jeju Island, South Korea (19-22 Nov. 2001)] Advances in Electronic Materials and Packaging 2001 (Cat. No.01EX506) - Adaptation of neural network and application of digital ultrasonic image processing for the pattern recognition of defects in semiconductor

โœ Scribed by Jae-Yeol Kim, ; Hyun-Jo Jeong, ; Hun-Cho Kim, ; Chang-Hyun Kim,


Book ID
125484482
Publisher
IEEE
Year
2001
Tongue
English
Weight
868 KB
Category
Article
ISBN-13
9780780371576

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