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[IEEE Advances in Electronic Materials and Packaging 2001 - Jeju Island, South Korea (19-22 Nov. 2001)] Advances in Electronic Materials and Packaging 2001 (Cat. No.01EX506) - Experimental determination of thin film adhesion using 4 point bending specimen

✍ Scribed by Kim, J.H.; Sae Bom Lee, ; Earmme, Y.Y.

No coin nor oath required. For personal study only.

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