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[IEEE 7th International Symposium on Quality Electronic Design (ISQED'06) - San Jose, CA, USA (27-29 March 2006)] 7th International Symposium on Quality Electronic Design (ISQED'06) - Interconnect and Thermal-aware Floorplanning for 3D Microprocessors

✍ Scribed by Hung, W.-L.; Link, G.M.; Xie, Y.; Vijaykrishnan, N.; Irwin, M.J.

Book ID: 115489940
Publisher: IEEE
Year: 2006
Tongue: English
Weight: 283 KB
Volume: 0
Category: Article
ISBN-13: 9780769525235
DOI: 10.1109/isqed.2006.77

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