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[IEEE 51st Electronic Components and Technology Conference 2001. Proceedings - Orlando, FL, USA (29 May-1 June 2001)] 2001 Proceedings. 51st Electronic Components and Technology Conference (Cat. No.01CH37220) - Room-temperature direct bonding of CMP-Cu film for bumpless interconnection

✍ Scribed by Shigetou, A.; Hosoda, N.; Itoh, T.; Suga, T.

Book ID: 126740809
Publisher: IEEE
Year: 2001
Weight: 757 KB
Category: Article
ISBN-13: 9780780370388
DOI: 10.1109/ECTC.2001.927858

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