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[IEEE 51st Electronic Components and Technology Conference 2001. Proceedings - Orlando, FL, USA (29 May-1 June 2001)] 2001 Proceedings. 51st Electronic Components and Technology Conference (Cat. No.01CH37220) - Compliant cantilevered spring interconnects for flip-chip packaging

✍ Scribed by Lunyu Ma, ; Qi Zhu, ; Sitaraman, S.K.; Chua, C.; Fork, D.K.

Book ID: 126701216
Publisher: IEEE
Year: 2001
Weight: 265 KB
Category: Article
ISBN-13: 9780780370388
DOI: 10.1109/ECTC.2001.927863

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