𝔖 Bobbio Scriptorium

✦ LIBER ✦

[IEEE 51st Electronic Components and Technology Conference 2001. Proceedings - Orlando, FL, USA (29 May-1 June 2001)] 2001 Proceedings. 51st Electronic Components and Technology Conference (Cat. No.01CH37220) - Influence of temperature and humidity on adhesion of underfills for flip chip packaging

✍ Scribed by Shijian Luo, ; Wong, C.P.

Book ID: 126633768
Publisher: IEEE
Year: 2001
Weight: 231 KB
Category: Article
ISBN-13: 9780780370388
DOI: 10.1109/ECTC.2001.927711

No coin nor oath required. For personal study only.

📜 SIMILAR VOLUMES

[IEEE 51st Electronic Components and Tec

[IEEE 51st Electronic Components and Technology Conference 2001. Proceedings - Orlando, FL, USA (29 May-1 June 2001)] 2001 Proceedings. 51st Electronic Components and Technology Conference (Cat. No.01CH37220) - Compliant cantilevered spring interconnects for flip-chip packaging

✍ Lunyu Ma, ; Qi Zhu, ; Sitaraman, S.K.; Chua, C.; Fork, D.K. 📂 Article 📅 2001 🏛 IEEE ⚖ 265 KB

[IEEE 51st Electronic Components and Tec

[IEEE 51st Electronic Components and Technology Conference 2001. Proceedings - Orlando, FL, USA (29 May-1 June 2001)] 2001 Proceedings. 51st Electronic Components and Technology Conference (Cat. No.01CH37220) - Progress on developing electronic packaging educational modules

✍ Kim, B.C.; Severance, C. 📂 Article 📅 2001 🏛 IEEE ⚖ 260 KB

[IEEE 51st Electronic Components and Tec

[IEEE 51st Electronic Components and Technology Conference 2001. Proceedings - Orlando, FL, USA (29 May-1 June 2001)] 2001 Proceedings. 51st Electronic Components and Technology Conference (Cat. No.01CH37220) - Reliability study of high-pin-count flip-chip BGA

✍ Yuan Li, ; Xie, J.; Verma, T.; Wang, V. 📂 Article 📅 2001 🏛 IEEE ⚖ 250 KB

[IEEE 51st Electronic Components and Tec

[IEEE 51st Electronic Components and Technology Conference 2001. Proceedings - Orlando, FL, USA (29 May-1 June 2001)] 2001 Proceedings. 51st Electronic Components and Technology Conference (Cat. No.01CH37220) - Sensitivity derivatives of dissimilar material junctions in electronic packages

✍ Guven, I.; Barut, A.; Madenci, E. 📂 Article 📅 2001 🏛 IEEE ⚖ 968 KB

[IEEE 51st Electronic Components and Tec

[IEEE 51st Electronic Components and Technology Conference 2001. Proceedings - Orlando, FL, USA (29 May-1 June 2001)] 2001 Proceedings. 51st Electronic Components and Technology Conference (Cat. No.01CH37220) - Parameterized models for a RF chip-to-substrate interconnect

✍ Doerr, I.; Lih-Tyng Hwang, ; Sommer, G.; Oppermann, H.; Li, L.; Petras, M.; Korf 📂 Article 📅 2001 🏛 IEEE ⚖ 756 KB

[IEEE 51st Electronic Components and Tec

[IEEE 51st Electronic Components and Technology Conference 2001. Proceedings - Orlando, FL, USA (29 May-1 June 2001)] 2001 Proceedings. 51st Electronic Components and Technology Conference (Cat. No.01CH37220) - Distributed SPICE circuit model for ceramic capacitors

✍ Smith, L.D.; Hockanson, D. 📂 Article 📅 2001 🏛 IEEE ⚖ 319 KB