𝔖 Bobbio Scriptorium

✦ LIBER ✦

[IEEE 4th International Symposium on Advanced Packaging Materials Processes, Properties and Interfaces - Braselton, GA, USA (15-18 March 1998)] Proceedings. 4th International Symposium on Advanced Packaging Materials Processes, Properties and Interfaces (Cat. No.98EX153) - Heat transfer modules for cooling electronics packages

✍ Scribed by Black, W.Z.; Giezer, A.; Hartley, J.G.

Book ID: 126676013
Publisher: IEEE
Year: 1998
Weight: 462 KB
Category: Article
ISBN-13: 9780780347953
DOI: 10.1109/ISAPM.1998.664461

No coin nor oath required. For personal study only.

📜 SIMILAR VOLUMES

[IEEE 4th International Symposium on Adv

[IEEE 4th International Symposium on Advanced Packaging Materials Processes, Properties and Interfaces - Braselton, GA, USA (15-18 March 1998)] Proceedings. 4th International Symposium on Advanced Packaging Materials Processes, Properties and Interfaces (Cat. No.98EX153) - Advances in ceramic packaging for power amplifiers

✍ Sigliano, R.E.; Gaughan, F.J. 📂 Article 📅 1998 🏛 IEEE ⚖ 220 KB

[IEEE 4th International Symposium on Adv

[IEEE 4th International Symposium on Advanced Packaging Materials Processes, Properties and Interfaces - Braselton, GA, USA (15-18 March 1998)] Proceedings. 4th International Symposium on Advanced Packaging Materials Processes, Properties and Interfaces (Cat. No.98EX153) - Thin film polymeric materials in microelectronic packaging and interconnect

✍ Garrou, P. 📂 Article 📅 1998 🏛 IEEE ⚖ 693 KB

[IEEE 4th International Symposium on Adv

[IEEE 4th International Symposium on Advanced Packaging Materials Processes, Properties and Interfaces - Braselton, GA, USA (15-18 March 1998)] Proceedings. 4th International Symposium on Advanced Packaging Materials Processes, Properties and Interfaces (Cat. No.98EX153) - Characterization of adhesive materials for high circuit density applications

✍ Aschenbrenner, R.; Miessner, R.; Becker, K.F.; Reichl, I. 📂 Article 📅 1998 🏛 IEEE ⚖ 638 KB

[IEEE 4th International Symposium on Adv

[IEEE 4th International Symposium on Advanced Packaging Materials Processes, Properties and Interfaces - Braselton, GA, USA (15-18 March 1998)] Proceedings. 4th International Symposium on Advanced Packaging Materials Processes, Properties and Interfaces (Cat. No.98EX153) - Immersion cooling of high heat flux microelectronics with dielectric liquids

✍ Arik, M.; Bar-Cohen, A. 📂 Article 📅 1998 🏛 IEEE ⚖ 981 KB

[IEEE 4th International Symposium on Adv

[IEEE 4th International Symposium on Advanced Packaging Materials Processes, Properties and Interfaces - Braselton, GA, USA (15-18 March 1998)] Proceedings. 4th International Symposium on Advanced Packaging Materials Processes, Properties and Interfaces (Cat. No.98EX153) - Advances in flip chip underfill material cure rates and reliability

✍ Daqing Max Shi, ; McKeen, K.; Jenson, B. 📂 Article 📅 1998 🏛 IEEE ⚖ 243 KB

[IEEE 4th International Symposium on Adv

[IEEE 4th International Symposium on Advanced Packaging Materials Processes, Properties and Interfaces - Braselton, GA, USA (15-18 March 1998)] Proceedings. 4th International Symposium on Advanced Packaging Materials Processes, Properties and Interfaces (Cat. No.98EX153) - Thermal greases with exceptionally high thermal conductivity and low thermal resistance

✍ Hunadi, R.; Wells, R. 📂 Article 📅 1998 🏛 IEEE ⚖ 394 KB