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[IEEE 4th International Symposium on Advanced Packaging Materials Processes, Properties and Interfaces - Braselton, GA, USA (15-18 March 1998)] Proceedings. 4th International Symposium on Advanced Packaging Materials Processes, Properties and Interfaces (Cat. No.98EX153) - Advances in flip chip underfill material cure rates and reliability

✍ Scribed by Daqing Max Shi, ; McKeen, K.; Jenson, B.

Book ID: 126624096
Publisher: IEEE
Year: 1998
Weight: 243 KB
Category: Article
ISBN-13: 9780780347953
DOI: 10.1109/ISAPM.1998.664429

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