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[IEEE 4th IEEE International Conference on Polymers and Adhesives in Microelectronics and Photonics, 2004. POLYTRONIC 2004. - Portland, OR, USA (12-15 Sept. 2004)] 4th IEEE International Conference on Polymers and Adhesives in Microelectronics and Photonics, 2004. POLYTRONIC 2004. - Application of critical stress intensity factors to evaluate adhesive failure at underfill/passivation interface singularities

✍ Scribed by McAdams, B.J.; Pearson, R.A.

Book ID: 126654598
Publisher: IEEE
Year: 2004
Weight: 489 KB
Category: Article
ISBN-13: 9780780387447
DOI: 10.1109/POLYTR.2004.1402735

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