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[IEEE 4th IEEE International Conference on Polymers and Adhesives in Microelectronics and Photonics, 2004. POLYTRONIC 2004. - Portland, OR, USA (12-15 Sept. 2004)] 4th IEEE International Conference on Polymers and Adhesives in Microelectronics and Photonics, 2004. POLYTRONIC 2004. - Conductiveadhesives containing Ag-Sn alloys as conductive filler

✍ Scribed by Suzuki, K.; Shirai, Y.; Mizumura, N.; Komagata, M.

Book ID: 126605184
Publisher: IEEE
Year: 2004
Tongue: English
Weight: 348 KB
Category: Article
ISBN-13: 9780780387447
DOI: 10.1109/POLYTR.2004.1402739

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