[IEEE 2014 IEEE International Solid- State Circuits Conference (ISSCC) - San Francisco, CA, USA (2014.02.9-2014.02.13)] 2014 IEEE International Solid-State Circuits Conference Digest of Technical Papers (ISSCC) - 19.1 A 128Gb MLC NAND-Flash device using 16nm planar cell

[IEEE 2014 IEEE International Solid- Sta

[IEEE 2014 IEEE International Solid- State Circuits Conference (ISSCC) - San Francisco, CA, USA (2014.02.9-2014.02.13)] 2014 IEEE International Solid-State Circuits Conference Digest of Technical Papers (ISSCC) - F5: Low-power radios for sensor networks

✍ Rhee, Woogeun; Burra, Gangadhar; Arimoto, Kazutami; Harpe, Pieter; Otis, Brian; 📂 Article 📅 2014 🏛 IEEE ⚖ 423 KB

[IEEE 2014 IEEE International Solid- Sta

[IEEE 2014 IEEE International Solid- State Circuits Conference (ISSCC) - San Francisco, CA, USA (2014.02.9-2014.02.13)] 2014 IEEE International Solid-State Circuits Conference Digest of Technical Papers (ISSCC) - 19.5 Three-dimensional 128Gb MLC vertical NAND Flash-memory with 24-WL stacked layers and 50MB/s high-speed programming

✍ Park, Ki Tae (author);Han, Jin Man (author);Kim, Daehan (author);Nam, Sangwan (a 📂 Article 📅 2014 🏛 Institute of Electrical and Electronics Engineers ⚖ 807 KB

[IEEE 2014 IEEE International Solid- Sta

[IEEE 2014 IEEE International Solid- State Circuits Conference (ISSCC) - San Francisco, CA, USA (2014.02.9-2014.02.13)] 2014 IEEE International Solid-State Circuits Conference Digest of Technical Papers (ISSCC) - 19.5 Three-dimensional 128Gb MLC vertical NAND Flash-memory with 24-WL stacked layers and 50MB/s high-speed programming

✍ Park, Ki Tae (author);Han, Jin Man (author);Kim, Daehan (author);Nam, Sangwan (a 📂 Article 📅 2014 🏛 Institute of Electrical and Electronics Engineers ⚖ 807 KB

[IEEE 2014 IEEE International Solid- Sta

[IEEE 2014 IEEE International Solid- State Circuits Conference (ISSCC) - San Francisco, CA, USA (2014.02.9-2014.02.13)] 2014 IEEE International Solid-State Circuits Conference Digest of Technical Papers (ISSCC) - F6: Energy-efficient I/O design for next-generation systems

✍ O'Mahony, Frank; da Dalt, Nicola; Chang, Ken; Yamaguchi, Hisakatsu; Kim, Chulwoo 📂 Article 📅 2014 🏛 IEEE ⚖ 667 KB

[IEEE 2014 IEEE International Solid- Sta

[IEEE 2014 IEEE International Solid- State Circuits Conference (ISSCC) - San Francisco, CA, USA (2014.02.9-2014.02.13)] 2014 IEEE International Solid-State Circuits Conference Digest of Technical Papers (ISSCC) - F2: 3D stacking technologies for image sensors and memories

✍ Oike, Yusuke; Oike, Yusuke; Ikeda, Makoto; Theuwissen, Albert; Solhusvik, Johann 📂 Article 📅 2014 🏛 IEEE ⚖ 199 KB

[IEEE 2014 IEEE International Solid- Sta

[IEEE 2014 IEEE International Solid- State Circuits Conference (ISSCC) - San Francisco, CA, USA (2014.02.9-2014.02.13)] 2014 IEEE International Solid-State Circuits Conference Digest of Technical Papers (ISSCC) - 13.6 A 28nm 400MHz 4-parallel 1.6Gsearch/s 80Mb ternary CAM

✍ Nii, Koji; Amano, Teruhiko; Watanabe, Naoya; Yamawaki, Minoru; Yoshinaga, Kenji; 📂 Article 📅 2014 🏛 IEEE ⚖ 863 KB