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[IEEE 2014 IEEE International Solid- State Circuits Conference (ISSCC) - San Francisco, CA, USA (2014.02.9-2014.02.13)] 2014 IEEE International Solid-State Circuits Conference Digest of Technical Papers (ISSCC) - F2: 3D stacking technologies for image sensors and memories

✍ Scribed by Oike, Yusuke; Oike, Yusuke; Ikeda, Makoto; Theuwissen, Albert; Solhusvik, Johannes; Chang, Jonathan; Kuroda, Tadahiro

Book ID: 125526326
Publisher: IEEE
Year: 2014
Weight: 199 KB
Category: Article
ISBN: 1479909181
DOI: 10.1109/ISSCC.2014.6757541

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