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[IEEE 2013 International Conference on IC Design & Technology (ICICDT) - Pavia, Italy (2013.05.29-2013.05.31)] Proceedings of 2013 International Conference on IC Design & Technology (ICICDT) - TSV count minimization and thermal analysis for 3D Tree-based FPGA

✍ Scribed by Pangracious, Vinod; Mehrez, Habib; Marakchi, Zied

Book ID: 125455749
Publisher: IEEE
Year: 2013
Weight: 240 KB
Category: Article
ISBN: 1467347418
DOI: 10.1109/icicdt.2013.6563341

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