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[IEEE 2013 IEEE/CPMT 29th Semiconductor Thermal Measurement & Management Symposium (SemiTherm 2013) - San Jose, CA (2013.3.17-2013.3.21)] 29th IEEE Semiconductor Thermal Measurement and Management Symposium - Feasibility of non-linear analysis of the BEoL structure in a flip chip package under thermal shock

✍ Scribed by Raman, Thiagarajan; Mirza, F.; Agonafer, D.; Lawrence, K.

Book ID: 126597699
Publisher: IEEE
Year: 2013
Weight: 753 KB
Category: Article
ISBN: 1467364282
DOI: 10.1109/SEMI-THERM.2013.6526817

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