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[IEEE 2013 IEEE/CPMT 29th Semiconductor Thermal Measurement & Management Symposium (SemiTherm 2013) - San Jose, CA (2013.3.17-2013.3.21)] 29th IEEE Semiconductor Thermal Measurement and Management Symposium - Thermal design guidelines for a three-dimensional (3D) chip stack, including cooling solutions

✍ Scribed by Matsumoto, K.; Ibaraki, S.; Sueoka, K.; Sakuma, K.; Kikuchi, H.; Orii, Y.; Yamada, F.; Fujihara, K.; Takamatsu, J.; Kondo, K.

Book ID: 126620460
Publisher: IEEE
Year: 2013
Weight: 627 KB
Category: Article
ISBN: 1467364282
DOI: 10.1109/SEMI-THERM.2013.6526797

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