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[IEEE 2013 IEEE International Symposium on Electromagnetic Compatibility - EMC 2013 - Denver, CO, USA (2013.08.5-2013.08.9)] 2013 IEEE International Symposium on Electromagnetic Compatibility - Full-wave modeling of inductive coupling links for low-power 3D system integration

✍ Scribed by Vali, Tommaso; Marotta, Giulio; De Santis, Luca; Antonini, Giulio; Romano, Daniele; De Luca, Giovanni

Book ID: 126058209
Publisher: IEEE
Year: 2013
Weight: 449 KB
Category: Article
ISBN: 1479904090
DOI: 10.1109/ISEMC.2013.6670374

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