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[IEEE 2013 IEEE International Symposium on Electromagnetic Compatibility - EMC 2013 - Denver, CO, USA (2013.08.5-2013.08.9)] 2013 IEEE International Symposium on Electromagnetic Compatibility - Modelling of wireless electromagnetic environment effects in multi-interconnected metallic cabins using the leapfrog ADI-FDTD method

✍ Scribed by Zhai, Meng-Lin; Yin, Wen-Yan; Chen, Zhizhang

Book ID: 125849332
Publisher: IEEE
Year: 2013
Weight: 768 KB
Category: Article
ISBN: 1479904090
DOI: 10.1109/ISEMC.2013.6670468

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