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[IEEE 2013 IEEE 26th International Conference on Micro Electro Mechanical Systems (MEMS) - Taipei, Taiwan (2013.01.20-2013.01.24)] 2013 IEEE 26th International Conference on Micro Electro Mechanical Systems (MEMS) - Wafer level packaging for RF MEMS devices using void free copper filled through glass via

✍ Scribed by Lee, Ju-Yong; Lee, Sung-Woo; Lee, Seung-Ki; Park, Jae-Hyoung

Book ID: 121210520
Publisher: IEEE
Year: 2013
Weight: 575 KB
Category: Article
ISBN: 1467356549
DOI: 10.1109/MEMSYS.2013.6474357

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