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[IEEE 2013 36th International Spring Seminar on Electronics Technology (ISSE) - Alba Iulia, Romania (2013.05.8-2013.05.12)] Proceedings of the 36th International Spring Seminar on Electronics Technology - Investigating copper wire bonding technology in Chip-on-Board applications

✍ Scribed by Krammer, Oliver; Roka, Peter; Jakab, Laszlo

Book ID: 125504897
Publisher: IEEE
Year: 2013
Weight: 537 KB
Category: Article
ISBN: 1479900362
DOI: 10.1109/ISSE.2013.6648222

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