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[IEEE 2012 IEEE International Ultrasonics Symposium - Dresden, Germany (2012.10.7-2012.10.10)] 2012 IEEE International Ultrasonics Symposium - Wafer bonding of polycrystalline spinel with LiNbO3/LiTaO3 for temperature compensation of RF surface acoustic wave devices

✍ Scribed by Geshi, K.; Teraoka, K.; Kinoshita, S.; Nakayama, M.; Imagawa, Y.; Nakayama, S.; Hashimoto, K.; Tanaka, S.; Totsu, K.; Takagi, H.

Book ID: 121264822
Publisher: IEEE
Year: 2012
Weight: 142 KB
Category: Article
ISBN: 1467345601
DOI: 10.1109/ULTSYM.2012.0683

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