✦ LIBER ✦

[IEEE 2012 IEEE International Ultrasonics Symposium - Dresden, Germany (2012.10.7-2012.10.10)] 2012 IEEE International Ultrasonics Symposium - A study of optimum material for SAW bonded wafer

✍ Scribed by Kawachi, O.; Taniguchi, N.; Tajima, M.; Nishizawa, T.

No coin nor oath required. For personal study only.

📜 SIMILAR VOLUMES

[IEEE 2012 IEEE International Ultrasonic

✍ Nicolay, P.; Elmazria, O.; Perois, X. 📂 Article 📅 2012 🏛 IEEE ⚖ 484 KB

[IEEE 2012 IEEE International Ultrasonic

✍ Moulzolf, Scott C.; Behanan, Roby; Lad, Robert J.; da Cunha, Mauricio Pereira 📂 Article 📅 2012 🏛 IEEE ⚖ 161 KB

[IEEE 2012 IEEE International Ultrasonic

✍ Duo Liu, ; Xinen Zhu, ; Tao Han, 📂 Article 📅 2012 🏛 IEEE ⚖ 757 KB

[IEEE 2012 IEEE International Ultrasonic

✍ Inoue, S.; Iwaki, M.; Tsutsumi, J.; Nakamura, H.; Ueda, M.; Satoh, Y.; Mitobe, S 📂 Article 📅 2012 🏛 IEEE ⚖ 190 KB

[IEEE 2012 IEEE International Ultrasonic

✍ Weihnacht, M.; Sotnikov, A.; Schmidt, H.; Wall, B.; Grunwald, R. 📂 Article 📅 2012 🏛 IEEE ⚖ 880 KB

[IEEE 2012 IEEE International Ultrasonic

✍ Mashimo, Tomoaki; Shibuya, Ryota; Terashima, Kazuhiko 📂 Article 📅 2012 🏛 IEEE ⚖ 917 KB